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Technical Guide
Resistance to Soldering Heat
20
10
0
-10
Test condition : 260 ° C, 30sec
NS series 10V 220μF ( φ 10 × 12.5L)
NS series 16V 33μF ( φ 6.3 × 7L)
-20
0
1
2
3
4
5
10
1
0.1
0.01
0
1
2
3
4
5
Fevering Temperature by Ripple Current
100
10
L8 series 2.5V 560μF ( φ 8 × 8L)
R7 series 2.5V 820μF ( φ 8 × 11.5L)
R7 series 4.0V 820μF ( φ 10 × 12.5L)
I 2 R = Δ T × β× S= Δ Tc ×α×β× S
Δ Tc = (I 2 R) / ( α×β× S)
log Δ Tc = log (I 2 R) / ( αβ S)
= log I 2 + log R – log αβ S
= 2 × log I + (log R - log αβ S)
= 2 × log I + A
Where,
1
1
10
I : Ripple Current (Arms)
R : ESR ( Ω )
Δ T : Fevering Temp. at Outside Wall of Capacitor ( ° C)
Δ Tc : Fevering Temp. at Inside of Capacitor ( ° C)
β : Heat Radiation coefficient (W/ ° C × cm 2 )
S : Surface Area of Aluminum Case(cm 2 )
α : Ratio of Δ Tc/ Δ T
Current (Arms)
52
NICHICON CORPORATION / FPCAP ELECTRONICS (SUZHOU) CO., LTD.
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